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Job Descrption

Meta is looking for an experienced Silicon Packaging Engineer for its Ecosystem and Technical Operation team. The ideal candidate will be able to operate in a highly multi-tasked, fast-paced and very cross-functional engineering environment. They will have experience with hardware development and integration of machine learning clusters, both server and fabric. They will be very familiar with AI/HPC hardware development, and will be data-driven and focused on the impact they can create as part of a world-class engineering team.

The Meta Infrastructure team designs, builds, brings-up, tests and integrates hardware systems that power Meta’s platforms, deployed in data centers worldwide, from silicon to sheet metal. Designs are published through the Open Compute Project Foundation.This is a rare opportunity to join our team and help us build some of the world’s most open and efficient machine learning platforms.

We are building a competency in packaging design and technology to support the development of custom silicons for Infrastructure hardware as well as to develop packaging solutions that are optimal for our AI/ML products and system level performance.Silicon Packaging Engineer Responsibilities

• Development of advanced packaging technologies( SMT, solder ball attach, and other assembly process) roadmap for AI/ML and networking products applications.
• Drive disruptive packaging technologies roadmap to create differentiation for Meta ASIC's Influence ASIC vendors, foundry and OSATs partners roadmap and align with Meta ASIC's roadmap
• Lead development of disruptive advanced packaging technologies from concept to product
• Drive ecosystem partners for 2.5D/3D and large packages SMT roadmap
• Perform package design for AI/ML and networking applications custom Si with single-chip/multi-chip and SiP/module packaging, design feasibility studies and analyses to ensure good manufacturing at ODM.
• Participate early on Si/package/PCB/system co-design, and ODM SMT manufacturing work in product development design reviews providing feedback on manufacturability and helps incorporate latest technology advancements and design rules.
• Work with internal Si, architecture and system teams and externally engaged partners, ODM, design houses and OSAT companies.
• Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve package form factor for next generation versions of current products.
• Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities.
• Work cross-functionally with design, NPI, quality and reliability, manufacturing teams and support new technology integration into products
• Support selection, and qualification of external partners (ODM, OEM, OSAT).
• Drafting of SMT assembly and advanced packaging technology definition documentation
• Collaborate with internal and external stakeholders to ensure seamless integration of packaging technology into product development cycles.
• Stay abreast of the latest advancements in advanced packaging technologies and market trends.
• Identify and evaluate emerging technologies with potential for future applications.

Minimum Qualifications

• BS in Materials Science, Mechanical Engineering or equivalent industry experience
• 15+ years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing
• In-depth knowledge of flip chip, 2.5D and 3D packaging technologies
• Experience taking products from concept to production including development of manufacturing specifications, vendor qualifications and improvement of manufacturing efficiencies and costs
• Effective communication skills
• Experience working effectively with cross-functional teams

Preferred Qualifications

• Masters Degree or PhD in Materials Science, Mechanical Engineering, or other related disciplines
• 18+ years of experience in advanced packaging assembly process, SMT
• Proven understanding of fanout advanced packaging technologies
• Experience working with ODM, assembly packaging, OSAT, and foundry partners
• Proven technical understanding of full range of semiconductor packaging materials, material interactions, SMT processes, PCB design and layout tools, failure mechanisms and analytical techniques
• Familiarity or experience with Finite Element Modeling (FEM) of thermal and thermo-mechanical behavior of packages
• Proven knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
• Understanding of package qualification and reliability methods and failure analysis

LocationsAbout Meta Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today—beyond the constraints of screens, the limits of distance, and even the rules of physics. Meta is committed to providing reasonable support (called accommodations) in our recruiting processes for candidates with disabilities, long term conditions, mental health conditions or sincerely held religious beliefs, or who are neurodivergent or require pregnancy-related support. If you need support, please reach out to accommodations-ext@fb.com. $204,000/year to $281,000/year + bonus + equity + benefits

Individual pay is determined by skills, qualifications, experience, and location. Compensation details listed in this posting reflect the base salary only, and do not include bonus, equity or sales incentives, if applicable. In addition to base salary, Meta offers benefits. Learn more about benefits at Meta.

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