Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.
Qorvo is looking for experienced Semiconductor Packaging Engineers with demonstrated success in RF Packaging who can join Qorvo’s Packaging Center of Excellence, in Greensboro, NC.
Ideal candidate will utilize their broad packaging experience to develop and drive new packaging technologies for next generation product requirements from concept to high volume manufacturing.
Strong communication and presentation skills. Ability to excel in a dynamic collaborative team environment including working directly with the product line design teams.
Responsibilities include:
- Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
- Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
- Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem solving.
- Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing.
- Develop and deploy advanced design rules into next generation products.
Work in collaboration with technology and business units to deploy next generation packaging solutions incorporating GaN, Si and GaAs semiconductor devices into products.
Preferred Skills:
- Thorough industry knowledge and experience of packaging technologies.
- Strong background in process / packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages.
- Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc.
- Strong understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment
- Proven track record of supporting New Product and/or Technology through innovative packaging solutions.
- Ability to utilize SPC techniques, DOE, and structured problem solving methodologies (e.g. DMAIC, 8D).
- Experience with Program Management Methodology
Required Experience:
- 7-10 years’ direct experience in semiconductor packaging.
- BS, or higher in Engineering or Material science.
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MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.
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